IPC 7095A


Design and Assembly Process Implementation for BGAs
standard by Association Connecting Electronics Industries, 01/01/2005



Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. Revision A of this document delivers useful and practical information to anyone who is currently using BGAs or is considering a conversion to area array packaging formats. In addition to providing guidelines for BGA inspection and repair, IPC-7095A also addresses reliability issues and the use of lead free joint criteria associated with BGAs. There are many new photographs of X-ray or endoscope illustrations to identify some of the chracteristics that the industry is experiencing in the implementation of BGA assembly processes. The effect of BGA and FBGA on current technology and component types is also discussed.

Product Details

ANSI Approved
Number of Pages:
File Size:
1 file , 2.8 MB
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