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Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
| Published by | Publication Date | Number of Pages |
| IPC | 05/01/1998 | 44 |
Description
IPC 2225 – Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
This standard establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties, relationships with DFM and DFE.
Product Details
- Published:
- 05/01/1998
- ANSI:
- ANSI Approved
- Number of Pages:
- 44
- File Size:
- 1 file , 590 KB
- Product Code(s):
- 2225(D)1
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
