This standard establishes and maintains a compilation of microelectronic package case outlines and should be useful to all levels of manufacturing that culminate in the production of reliable and logistically supportable military electronic equipement.
Product Details
- Published:
- 09/03/1996
- Number of Pages:
- 192
- File Size:
- 1 file , 960 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
